CBRHDSH1-100 TR13

CBRHDSH1-100 SURFACE MOUNT HIGH DENSITY 1 AMP SILICON SCHOTTKY BRIDGE RECTIFIER w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CBRHDSH1-100 is a full wave bridge rectifier in a durable epoxy surface mount molded case, designed for low voltage full wave rectification applications. The molding compound used in this device has UL flammability classification 94V-O. MARKING CODE: CSH110 FEATURES: HD DIP CASE • Low Leakage Current (40nA TYP @ VRRM) • Low Forward Voltage Drop Schottky Diodes • High 1.0A Current Rating MAXIMUM RATINGS: (TA=25°C unless otherwise noted) SYMBOL Peak Repetitive Reverse Voltage VRRM DC Blocking Voltage VR 100 UNITS V 100 V RMS Reverse Voltage Average Forward Current Peak Forward Surge Current Power Dissipation Operating Junction Temperature Storage Temperature Thermal Resistance VR(RMS) IO 71 V 1.0 A IFSM PD 20 A 1.2 W -50 to +125 °C -55 to +150 °C 85 °C/W TJ Tstg ΘJA ELECTRICAL CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP MAX IR VR=100V 0.04 10 IR IR VR=100V, TA=50°C VR=100V, TA=100°C BVR VF IR=150µA IF=500mA VF CJ IF=1.0A VR=4.0V, f=1.0MHz UNITS µA 1.0 mA 20 mA 100 V 615 700 mV 690 750 mV 230 pF R7 (19-August 2020) CBRHDSH1-100 SURFACE MOUNT HIGH DENSITY 1 AMP SILICON SCHOTTKY BRIDGE RECTIFIER HD DIP CASE - MECHANICAL OUTLINE SYMBOL A B C D E F G H J K L DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0.006 0.014 0.15 0.35 0.275 7.00 0.027 0.043 0.70 1.10 0.035 0.051 0.90 1.30 0.090 0.106 2.30 2.70 0.019 0.031 0.50 0.80 0.146 0.165 3.70 4.20 0.051 0.067 1.30 1.70 0.177 0.193 4.50 4.90 0.090 0.106 2.30 2.70 0.000 0.008 0.00 0.20 HD DIP (REV: R3) MARKING CODE: CSH110 R7 (19-August 2020) w w w. c e n t r a l s e m i . c o m CBRHDSH1-100 SURFACE MOUNT HIGH DENSITY 1 AMP SILICON SCHOTTKY BRIDGE RECTIFIER TYPICAL ELECTRICAL CHARACTERISTICS R7 (19-August 2020) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)